| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet pasting device capable of suppressing device upsizing.SOLUTION: A sheet pasting device 1 comprises: support means 2 for supporting a wafer WF; and pasting means 5 for pressing and pasting an adhesive sheet AS to the wafer WF supported by the support means 2. The support means 2 is provided so that the wafer WF arranged in a position apart from the support means 2 can be supported and transported. The pasting means 5 is provided so that the adhesive sheet AS can be pasted to the wafer WF being transported. |
