THERMAL CONDITIONING UNIT, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD

摘要

A thermal conditioning unit (100) to thermally condition a substrate (W) in a lithographic apparatus, the thermal conditioning unit including: a thermal conditioning element (200) having a first layer (210), in use, facing the substrate and including a material having a thermal conductivity of 100 W/mK or more, a second layer (220) and a heat transfer component (230) positioned between the first and second layers; and a stiffening member (110) which is stiffer than the thermal conditioning element and configured to support the thermal conditioning element so as to reduce mechanical deformation thereof, wherein the thermal conditioning element is thermally isolated from the stiffening member.