发明名称 WIRING CIRCUIT BOARD, SUSPENSION, SUSPENSION WITH HEAD, HARD DISK DRIVE, AND MANUFACTURING METHOD OF WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board which achieves excellent mechanical strength in a conductor layer at a terminal formation part.SOLUTION: A wiring circuit board includes: a wiring formation part; a terminal formation part for connecting with an external circuit; and an intermediate part continuously formed between the wiring formation part and the terminal formation part. The wiring formation part includes: a first insulation layer; a first conductor layer formed on the first insulation layer; a second insulation layer formed on the first conductor layer; and a second conductor layer formed on the second insulation layer so as to overlap with the first conductor layer in a thickness direction. The terminal formation part includes the first conductor layer, and a third conductor layer is formed on the first conductor layer in the terminal formation part. The third conductor layer is formed so as to contact with a surface of the second insulation layer in the intermediate part. The above object is achieved by providing the wiring circuit board.
申请公布号 JP2013236106(A) 申请公布日期 2013.11.21
申请号 JP20130167370 申请日期 2013.08.12
申请人 DAINIPPON PRINTING CO LTD 发明人 KAWASAKI HIROSHI;NARITA YUJI;OTA TAKAYUKI
分类号 H05K1/11;G11B5/60;G11B21/21 主分类号 H05K1/11
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