发明名称 |
WIRING CIRCUIT BOARD, SUSPENSION, SUSPENSION WITH HEAD, HARD DISK DRIVE, AND MANUFACTURING METHOD OF WIRING CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board which achieves excellent mechanical strength in a conductor layer at a terminal formation part.SOLUTION: A wiring circuit board includes: a wiring formation part; a terminal formation part for connecting with an external circuit; and an intermediate part continuously formed between the wiring formation part and the terminal formation part. The wiring formation part includes: a first insulation layer; a first conductor layer formed on the first insulation layer; a second insulation layer formed on the first conductor layer; and a second conductor layer formed on the second insulation layer so as to overlap with the first conductor layer in a thickness direction. The terminal formation part includes the first conductor layer, and a third conductor layer is formed on the first conductor layer in the terminal formation part. The third conductor layer is formed so as to contact with a surface of the second insulation layer in the intermediate part. The above object is achieved by providing the wiring circuit board. |
申请公布号 |
JP2013236106(A) |
申请公布日期 |
2013.11.21 |
申请号 |
JP20130167370 |
申请日期 |
2013.08.12 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
KAWASAKI HIROSHI;NARITA YUJI;OTA TAKAYUKI |
分类号 |
H05K1/11;G11B5/60;G11B21/21 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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