RESIN-ATTACHED LEAD FRAME, METHOD FOR MANUFACTURING THE SAME, AND LEAD FRAME

摘要

A resin-attached lead frame includes a lead frame main body having a plurality of die pads (LED element resting portions) and a plurality of lead portions spaced from the die pads, the lead frame main body further including LED element resting regions each formed over an area including an upper surface of each of the die pads and an upper surface of each of the lead portions. A reflecting resin section surrounds each LED element resting region of the lead frame main body. A vapor-deposited aluminum layer or a sputtered aluminum layer is provided on respective upper surfaces of the LED element resting regions of the lead frame main body.