| 摘要 |
<p>Provided are the following: an alkaline-developable thermosetting resin composition whereby the formation of cracks is inhibited, and in a dry-film configuration, a resin layer with good stability in the B-stage can be obtained; and a printed circuit board. This alkaline-developable thermosetting resin composition contains an alkaline-developable resin, a heat-reactive compound, a macromolecular resin, and a photobase generator and is characterized in that the alkaline-developable resin and the heat-reactive compound undergo an addition reaction upon selective light exposure, allowing negative pattern formation via alkaline development.</p> |
