| 摘要 |
PROBLEM TO BE SOLVED: To reduce contact resistance between an electrode pad and a conductor in a pressure-contact semiconductor device.SOLUTION: A semiconductor device 1 comprises a conductor 4 brought into pressure contact with an electrode pad 3 on a semiconductor element 2 and harder than the electrode pad 3. A concave-convex part 5 is formed on an end surface of the conductor 4 bonded to the electrode pad 3. A salient 53 having a spiry longitudinal surface is formed at an edge part of a salient 51 in the concave-convex part 5. The end surface of the conductor 4 having the concave-convex part 5 is preferably covered with a conductive material softer than the electrode pad 3 and the conductor 4 and having low electric resistance. |
