发明名称 |
TAPE FOR ELECTRONIC DEVICES WITH REINFORCED LEAD CRACK |
摘要 |
Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.
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申请公布号 |
US2013308289(A1) |
申请公布日期 |
2013.11.21 |
申请号 |
US201113982658 |
申请日期 |
2011.10.12 |
申请人 |
YOO DAE SUNG;KOO HAN MO;PARK KI TAE;LIM JUN YOUNG;HONG TAE KI;LG INNOTEK CO., LTD. |
发明人 |
YOO DAE SUNG;KOO HAN MO;PARK KI TAE;LIM JUN YOUNG;HONG TAE KI |
分类号 |
H05K7/02 |
主分类号 |
H05K7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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