| 摘要 |
An image sensor module includes a semiconductor chip, a transparent substrate, and metal lines. The semiconductor chip includes image sensors disposed in an image sensor region, pads electrically connected to the image sensors and disposed in a peripheral region defined along a periphery of the image sensor region, and through-electrodes electrically connected to the pads. The transparent substrate has a groove defined by a surface covering the image sensors and the pads of the semiconductor chip. The metal lines are disposed on a lower surface of the semiconductor chip and are electrically connected to the through-electrodes.
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