发明名称 EPOXY/VINYL COPOLYMER-TYPE LIQUID RESIN COMPOSITION, CURED ARTICLE THEREOF, ELECTRICAL/ELECTRONIC DEVICE USING SAID CURED ARTICLE, AND METHOD FOR PRODUCING SAID CURED ARTICLE
摘要 The present invention provides: an epoxy/vinyl copolymer-type liquid resin composition containing an epoxy resin having an epoxy resin equivalent weight of 200 g/eq or less, an acid anhydride having an unsaturated double bond which is liquid at normal temperature or a maleic anhydride and acid anhydride having an unsaturated double bond which are liquid at normal temperature, a multifunctional vinyl monomer which is liquid at normal temperature, an epoxy resin curing catalyst for promoting a curing reaction of the epoxy resin and the acid anhydride or the maleic anhydride and acid anhydride, and a radical polymerization catalyst for promoting a curing reaction of the multifunctional vinyl monomer; and a cured article thereof. This makes it possible to reduce varnish viscosity and improve the thermal resistance of the cured article. It is also possible to provide a cured article obtained by curing the thermosetting resin composition as well as an electrical/electronic device for which the cured article is an insulating material and/or structural material.
申请公布号 WO2013172064(A1) 申请公布日期 2013.11.21
申请号 WO2013JP53920 申请日期 2013.02.19
申请人 HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD. 发明人 AMOU SATORU
分类号 C08G59/20;C08G59/42;C08K7/00;C08L63/00 主分类号 C08G59/20
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