| 摘要 |
<p>A molding composition comprises a molding resin, a filler, and a moisture-absorbing material coated on the surface of the filler. A semiconductor package comprises a substrate, at least one chip mounted on the substrate, a connection part for electrically connecting the chip and the substrate, and a molding part sealing the chip on the substrate. The molding part consists of the molding composition including the molding resin, a plurality of the fillers, and the moisture-absorbing material coated on each of the fillers.</p> |
