Process for packaging a MEMS component

摘要

The micromechanical component has two components (101,102) that are connected by an alloying area (150). The components enclose a vacuum area or residual gas area (104) which is sealed by an alloying area. The alloying area has gold (Au)-silicon (Si) alloy, where the alloying area has a germanium (Ge)-aluminum (Al) alloy. One component is a sensor wafer or a sensor chip and other component is a cap wafer or cap chip. An independent claim is included for a manufacturing process for a micromechanical component.