| 摘要 |
The invention discloses a printing apparatus and a method for manufacturing a semiconductor packaging substrate by using the printing apparatus. The printing apparatus comprises a printing table which comprises a substrate provided on the printing table, wherein the substrate has a printing dry film formed thereon; a coating device used for printing bumps on the substrate; and a pair of clamping devices which comprises a first clamping device and a second clamping device, wherein the first clamping device and the second clamping device form inclined planes on the sides thereof contacted with the substrate, the inclined planes incline toward the substrate, and the pair of the clamping devices can rise or fall. The clamping device located at a printing starting point rises to an upper surface of the substrate, and the clamping device located at a printing ending point falls to a lower surface of the substrate. |
