| 发明名称 |
Assembly for a modular automation device |
| 摘要 |
<p>The assembly (2) has a surface mount device (SMD) printed circuit board arranged in a housing capsule (3). The SMD printed circuit board comprises a primary SMD sensor on one side of the printed circuit board for detecting the temperature of the supply air in the housing capsule. A secondary SMD sensor for detecting the printed circuit board temperature is arranged adjacent to the primary SMD sensor. The secondary SMD sensor is thermally decoupled from the supply air, and transmits the detected temperature of the monitoring unit for evaluation.</p> |
| 申请公布号 |
EP2665348(A1) |
申请公布日期 |
2013.11.20 |
| 申请号 |
EP20120167922 |
申请日期 |
2012.05.14 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
KORT, VALENTIN;CYRON, MICHAEL;MARENSKI, DIRK |
| 分类号 |
H05K7/14;G01K7/42 |
主分类号 |
H05K7/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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