| 摘要 |
<p>The assembly (1) has circuit carriers (3, 5) extending in sections parallel to each other. An electronic component i.e. semiconductor component, is firmly, electrically conductively connected with the circuit carriers by solder units (7, 9, 11, 13) i.e. solder paste. The circuit carriers comprise electrically insulating spacers (22, 24, 26), which are extended transverse to one of the circuit carriers up to the other circuit carrier. The spacers are made of ceramic or glasses and held in a recess or an opening (28) of the circuit carriers. The semiconductor component is designed as a semiconductor diode and semiconductor switches (15, 17) e.g. FET, insulated gate bipolar transistor or thyristor. An independent claim is also included for a method for electrically connecting an electronic component with circuit carriers.</p> |
