INSULTING EPOXY RESIN COMPOSITION, INSULTING FILM MADE THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME

摘要

The present invention provides an insulating epoxy resin composition, an insulating film manufactured therefrom, and a multilayer printed circuit board including the same. More specifically, the present invention relates to an insulating epoxy resin composition including a liquid crystal oligomer which decrease dielectric coefficient and thermal expansion coefficient of a build-up type multilayer printed circuit board, an insulating film manufactured by using the resin composition, and a multilayer printed circuit board which forms a multilayer by insulating the internal circuit formed of copper by using the insulating film.