| 摘要 |
The test system (10) has a test unit (30), and a manipulation device (20) that is provided with a receiving unit (40) with a socket (50). A packaged integrated circuit (60) is accommodated in the socket and is provided with a top side (62) and a bottom side (64), where multiple electrical terminal contacts (70) are formed on the bottom side. An electrical connection is formed between the socket and the terminal contacts. A sensor device is arranged on the top side of the integrated circuit, where the top side of the integrated circuit is oriented in a direction of the test unit. The electrical terminal contacts are electrically connected to the receiving unit of the manipulation device. An elastic sealing lip (92) is formed between a gas chamber (90) of the test unit and the top side of the integrated circuit. |
