METHOD AND APPARATUS FOR INSPECTING VIA HOLE

摘要

The present invention relates to a method and an apparatus for inspecting a via hole using a camera. Regarding a method for inspecting a via hole formed in a material, the method for inspecting a via hole of the present invention comprises the following steps: (a) an image is generated by photographing a via hole area; (b) an edge is extracted in the image; (c) a maximum value is detected by performing Hough Transform of the edge; (d) a circle area centering a position having the maximum value is calculated; and (e) the state of the via hole is determined by comparing the maximum value, the position and the circle area with a reference value. [Reference numerals] (411) Image is generated by photographing a via hole area;(421) Edge is extracted in the image;(431) Maximum value is detected by performing Hough Transform of the edge;(441) Circle area centering a position having the maximum value is calculated;(451) Maximum value and circle area are compared to reference values;(461) Fair treatment;(462) Fail treatment;(AA) Start;(BB) Maximum value and circle area > Reference values ?;(CC) End