| 摘要 |
An electronic component assembly includes a housing, 28, that provides a cavity, 34, filled with a cooling fluid that has a liquid phase and a vapor phase. An electronic element, 20, is arranged in the cavity, 34, and is configured to generate heat. A wicking material, 42, is arranged in the cavity, 34, between the housing, 28, and the electronic element, 20. The cavity, 34, provides a gap, 43, adjacent to the wicking material, 42. The wicking material, 42, is configured to absorb the liquid phase, and the vapor phase is arranged in the gap, 43. |
