发明名称 |
Multilayer capacitor, manufacturing method thereof, circuit board, and electronic device |
摘要 |
Provided is a multilayer capacitor that can be manufactured with high yields and whose warpage is suppressed. The multilayer capacitor includes two or more laminated bodies which are bonded together, the two or more laminated bodies each including resin layers and metal layers which are alternately laminated a plurality of times in a thickness direction and each being warped and having front and rear surfaces covered with surface layers containing a resin material, one of the front and rear surfaces being formed of a first surface as a smooth surface having no recess portion, another of the front and rear surfaces being formed of a second surface having a recess portion, in which at least two adjacent laminated bodies are bonded together at the first surfaces or the second surfaces. Also provided are a manufacturing method for the multilayer capacitor, and a circuit board and an electronic device which use the multilayer capacitor.
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申请公布号 |
US8587924(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US201013501357 |
申请日期 |
2010.10.13 |
申请人 |
TEZUKA TAKENORI;ITO CHIHARU;KAKO TOMONAO;RUBYCON CORPORATION |
发明人 |
TEZUKA TAKENORI;ITO CHIHARU;KAKO TOMONAO |
分类号 |
H01G4/228 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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