发明名称 |
Laminated antenna structures for package applications |
摘要 |
Apparatus and methods for packaging IC chips and laminated antenna structures with laminated waveguide structures that are integrally constructed as part of an antenna package to form compact integrated radio/wireless communications systems for millimeter wave applications.
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申请公布号 |
US8587482(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US201113011441 |
申请日期 |
2011.01.21 |
申请人 |
LIU DUIXIAN;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LIU DUIXIAN |
分类号 |
H01Q1/38 |
主分类号 |
H01Q1/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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