发明名称 |
Through silicon via dies and packages |
摘要 |
A method for preparing a die for packaging is disclosed. A die having first and second major surfaces is provided. Vias and a mask layer are formed on the first major surface of the die. The mask includes mask openings that expose the vias. The mask openings are filled with a conductive material. The method includes reflowing to at least partially fill the vias and contact openings to form via contacts in the vias and surface contacts in the mask openings.
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申请公布号 |
US8586465(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US20080133376 |
申请日期 |
2008.06.05 |
申请人 |
LIU HAO;SUN YI SHENG ANTHONY;KOLAN RAVI KANTH;TOH CHIN HOCK;UNITED TEST AND ASSEMBLY CENTER LTD |
发明人 |
LIU HAO;SUN YI SHENG ANTHONY;KOLAN RAVI KANTH;TOH CHIN HOCK |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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