发明名称 |
Laminated electronic component including water repellant and manufacturing method therefor |
摘要 |
A method for manufacturing a laminated electronic component includes the steps of preparing a laminated component main body, the component main body including internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes, applying a water repellant on a surface of the metal layer and a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.
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申请公布号 |
US8587923(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US20100788340 |
申请日期 |
2010.05.27 |
申请人 |
OGAWA MAKOTO;MOTOKI AKIHIRO;SARUBAN MASAHITO;IWANAGA TOSHIYUKI;TAKEUCHI SHUNSUKE;KAWASAKI KENICHI;MURATA MANUFACTURING CO., LTD. |
发明人 |
OGAWA MAKOTO;MOTOKI AKIHIRO;SARUBAN MASAHITO;IWANAGA TOSHIYUKI;TAKEUCHI SHUNSUKE;KAWASAKI KENICHI |
分类号 |
H01G4/228;H01G4/06 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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