发明名称 |
Integrated circuit packaging system with through silicon via base and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base having a through-conductor and having an insulator protecting the base and the through-conductor; mounting a chip over the base and connected to the base with a first interconnect; forming a second interconnect above the base and horizontally beside the chip; and encapsulating the chip, the first interconnect, and the second interconnect with an encapsulation. |
申请公布号 |
US8587129(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US20090534029 |
申请日期 |
2009.07.31 |
申请人 |
CHI HEEJO;CHO NAMJU;PARK YEONGIM;STATS CHIPPAC LTD. |
发明人 |
CHI HEEJO;CHO NAMJU;PARK YEONGIM |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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