发明名称 Flexible electronic device and method for the fabrication of same
摘要 A semiconductor device may have a thickness, such that the semiconductor devices are not flexible, and may be bonded and electrically coupled on a flexible substrate. After this bonding, the semiconductor device may be thinned so as to be rendered flexible.
申请公布号 US8586451(B2) 申请公布日期 2013.11.19
申请号 US201213533224 申请日期 2012.06.26
申请人 VINCIGUERRA VINCENZO;OCCHIPINTI LUIGIGIUSEPPE;STMICROELECTRONICS S.R.L. 发明人 VINCIGUERRA VINCENZO;OCCHIPINTI LUIGIGIUSEPPE
分类号 H01L21/46 主分类号 H01L21/46
代理机构 代理人
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