发明名称 |
Flexible electronic device and method for the fabrication of same |
摘要 |
A semiconductor device may have a thickness, such that the semiconductor devices are not flexible, and may be bonded and electrically coupled on a flexible substrate. After this bonding, the semiconductor device may be thinned so as to be rendered flexible. |
申请公布号 |
US8586451(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US201213533224 |
申请日期 |
2012.06.26 |
申请人 |
VINCIGUERRA VINCENZO;OCCHIPINTI LUIGIGIUSEPPE;STMICROELECTRONICS S.R.L. |
发明人 |
VINCIGUERRA VINCENZO;OCCHIPINTI LUIGIGIUSEPPE |
分类号 |
H01L21/46 |
主分类号 |
H01L21/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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