LIGHT-EMITTING DEVICE AND ELECTRONIC DEVICE

摘要

The present invention provides a highly reliable light emitting device. When external physical force is applied, the breakage of a device is suppressed. Damage to resin or wires touching a flexible substrate by heat is suppressed in an FPC compressing process. A neutral surface, which does not generate strain deformation to the deformation of a flexible light emitting device including an organic EL device, is placed around both sides of a transistor and the organic EL device. The hardness of the surface of the light emitting device is stiff. A substrate having less than 10 ppm/K of thermal expansivity is used as a substrate overlapped with a terminal part connected to the FPC.