发明名称 |
Wafer level interconnection of inverted metamorphic multijunction solar cells |
摘要 |
A method of forming a plurality of discrete, interconnected solar cells mounted on a carrier by providing a first semiconductor substrate; depositing on the first substrate a sequence of layers of semiconductor material forming a solar cell structure; forming a metal back contact layer over the solar cell structure; mounting a carrier on top of the metal back contact; removing the first substrate; and lithographically patterning and etching the solar cell structure to form a plurality of discrete solar cells mounted on the carrier.
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申请公布号 |
US8586859(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US201213560663 |
申请日期 |
2012.07.27 |
申请人 |
VARGHESE TANSEN;EMCORE SOLAR POWER, INC. |
发明人 |
VARGHESE TANSEN |
分类号 |
H01L31/042 |
主分类号 |
H01L31/042 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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