| 摘要 |
A heat dissipation substrate including a metal substrate, a metal layer, an insulating material layer and a patterned conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The metal layer has a first metal block and a second metal block surrounding the first metal block. A thickness of the first metal block is greater than a thickness of the second metal block. The insulating material layer is disposed on the second metal block. The patterned conductive layer is disposed on the insulating material layer and on the first metal block.
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