发明名称 Balanced on-die termination
摘要 Termination of a high-speed signaling link is effected by simultaneously engaging on-die termination structures within multiple integrated-circuit memory devices disposed on the same memory module, and/or within the same integrated-circuit package, and coupled to the high-speed signaling link.
申请公布号 US8588012(B2) 申请公布日期 2013.11.19
申请号 US201113149896 申请日期 2011.06.01
申请人 WILSON JOHN;KIM JOONG-HO;KOLLIPARA RAVINDRANATH;SECKER DAVID;OH KYUNG SUK;RAMBUS, INC. 发明人 WILSON JOHN;KIM JOONG-HO;KOLLIPARA RAVINDRANATH;SECKER DAVID;OH KYUNG SUK
分类号 G11C7/00 主分类号 G11C7/00
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