发明名称 |
Balanced on-die termination |
摘要 |
Termination of a high-speed signaling link is effected by simultaneously engaging on-die termination structures within multiple integrated-circuit memory devices disposed on the same memory module, and/or within the same integrated-circuit package, and coupled to the high-speed signaling link.
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申请公布号 |
US8588012(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US201113149896 |
申请日期 |
2011.06.01 |
申请人 |
WILSON JOHN;KIM JOONG-HO;KOLLIPARA RAVINDRANATH;SECKER DAVID;OH KYUNG SUK;RAMBUS, INC. |
发明人 |
WILSON JOHN;KIM JOONG-HO;KOLLIPARA RAVINDRANATH;SECKER DAVID;OH KYUNG SUK |
分类号 |
G11C7/00 |
主分类号 |
G11C7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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