发明名称 |
Seamless multi-poly structure and methods of making same |
摘要 |
A sensor array is integrated onto the same chip as core logic. The sensor array uses a first polysilicon and the core logic uses a second polysilicon. The first polysilicon is etched to provide a tapered profile edge in the interface between the sensor array and the core logic regions to avoid an excessive step. Amorphous carbon can be deposited over the interface region without formation of voids, thus providing for improved manufacturing yield and reliability.
|
申请公布号 |
US8587084(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US201213342148 |
申请日期 |
2012.01.02 |
申请人 |
FU SHIH-CHI;KUO CHING-SEN;LU WEN-CHEN;CHEN CHIH-YUAN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
FU SHIH-CHI;KUO CHING-SEN;LU WEN-CHEN;CHEN CHIH-YUAN |
分类号 |
H01L21/70;H01L21/76 |
主分类号 |
H01L21/70 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|