发明名称 Metal core substrate
摘要 A metal core substrate is provided. A first routing member is comprised of a first area of one sheet of metal core material; a first insulation layer formed on the first area; and a first circuit pattern made of a copper foil and formed on the first insulation layer. A second routing member comprised of: a second area of the one sheet of the metal core material, which is separated from the first area; a second insulation layer formed on the second area; and a second circuit pattern made of a copper foil and formed on the second insulation layer. A connecting member electrically connects the first routing member and the second routing member. The connecting member is comprised of a third area of the one sheet of the metal core material, which is interposed between the first area and the second area.
申请公布号 US8586872(B2) 申请公布日期 2013.11.19
申请号 US201113229786 申请日期 2011.09.12
申请人 SUGIURA TOMOHIRO;HARAO AKIRA;KUBOTA MINORU;YAZAKI CORPORATION 发明人 SUGIURA TOMOHIRO;HARAO AKIRA;KUBOTA MINORU
分类号 H05K1/09;H05K1/00 主分类号 H05K1/09
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