发明名称 Three-dimensional mask model for photolithography simulation
摘要 A three-dimensional mask model of the invention provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image.
申请公布号 US8589829(B2) 申请公布日期 2013.11.19
申请号 US201313736929 申请日期 2013.01.08
申请人 LIU PENG;CAO YU;CHEN LUOQI;YE JUN;ASML NETHERLANDS B.V. 发明人 LIU PENG;CAO YU;CHEN LUOQI;YE JUN
分类号 G06F17/50 主分类号 G06F17/50
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