发明名称 Conductive lines and pads and method of manufacturing thereof
摘要 A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer arranged on the substrate. A first conductive layer is arranged in or on insulating layer in the first region and a second conductive layer is arranged in or on the insulating layer in the second region. The first conductive layer comprises a first conductive material and the second conductive layer comprises a second conductive material wherein the first conductive material is different than the second conductive material. A metal layer is arranged on the first conductive layer.
申请公布号 US8586472(B2) 申请公布日期 2013.11.19
申请号 US20100836151 申请日期 2010.07.14
申请人 HAMPP ROLAND;FISCHER THOMAS;HOECKELE UWE;INFINEON TECHNOLOGIES AG 发明人 HAMPP ROLAND;FISCHER THOMAS;HOECKELE UWE
分类号 H01L21/44 主分类号 H01L21/44
代理机构 代理人
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