发明名称 |
Conductive lines and pads and method of manufacturing thereof |
摘要 |
A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer arranged on the substrate. A first conductive layer is arranged in or on insulating layer in the first region and a second conductive layer is arranged in or on the insulating layer in the second region. The first conductive layer comprises a first conductive material and the second conductive layer comprises a second conductive material wherein the first conductive material is different than the second conductive material. A metal layer is arranged on the first conductive layer.
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申请公布号 |
US8586472(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US20100836151 |
申请日期 |
2010.07.14 |
申请人 |
HAMPP ROLAND;FISCHER THOMAS;HOECKELE UWE;INFINEON TECHNOLOGIES AG |
发明人 |
HAMPP ROLAND;FISCHER THOMAS;HOECKELE UWE |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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