INDUCTOR FOR INTEGRATED CIRCUIT

摘要

Provided is an inductor for an integrated circuit which minimizes loss caused by a silicon substrate by connecting bonding wires connected with specific lead pins in parallel and has a parallel structure capable of improving a quality factor (Q) of the inductor by disposing the bonding wires, multiple lead pins and a board trace to maximize flux linkage through effective position arrangement of pads for the bonding wires and adjustment of the height of the bonding wires.