| 摘要 |
A plurality of substrates (2) are assigned on a plate (1) which is made of a hard-brittle material. Therefore, a first protective film (4) is formed on the surface of a plate (1) in an assigned location of each substrate (2), and a second protective film (5) is formed on the surface of the marginal space of the plate (1). The second protective film is installed so as to be at a distance required for cutting by a blast process away from the first protective film (4) and so that the circumference of the second protective film (5) is at 5 mm or less from the peripheral part of the plate (1). The parts between the first protective films (4) and between the first protective film (4) and the second protective film (5), as a cutting area (6), are cut up to about half of the thickness of the plate (1) from one side surface of the plate (1), and then are cut from the other side surface of the plate until the plate (1) passes through the cutting area. [Reference numerals] (AA) Peripheral part of the plate |
