| 摘要 |
<p>PURPOSE: A printed circuit board, a semiconductor package using the same, and a manufacturing method thereof are provided to reduce the process time for a plating process by forming a thin film plating layer. CONSTITUTION: A die pad part is formed in the upper part of an enhancement layer. A bonding pad part(150) is formed in the upper part of the enhancement layer. A Ni thin film plating layer(161) is formed on the bonding pad part. A thin film plating layer(163) is formed on the Ni thin film plating layer. The thin film plating layer is formed by plating Ag or Pd.</p> |
