HEATING MEMBER AND FUSING DEVICE ADOPTING THE SAME
摘要
The disclosed heating member for an anchoring device includes a resistance heating layer which is formed by dispersing electric conductive filers on a base polymer and receives heat by receiving electric energy. The storage modulus of the resistance heating layer is 1.0Mpa or more. The tangent loss rate of the resistance heating layer is 0.2 or less.
申请公布号
KR20130125275(A)
申请公布日期
2013.11.18
申请号
KR20120098419
申请日期
2012.09.05
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, SANG EUI;KIM, DONG EARN;KIM, DONG OUK;KIM, HA JIN;PARK, SUNG HOON;BAE, MIN JONG;SON, YOON CHUL;CHU, KUN MO;HAN, IN TAEK