| 摘要 |
<p>Provided is a chip-on-film which includes a flexible circuit film which includes a wire, a protective layer which includes a hole, an adhesive layer, a pad, an interconnection unit, and a bump. A part of the adhesive layer is arranged in the hole. The pad is arranged under the protective layer and a part of the pad is arranged under the hole. A part of the interconnection unit is arranged under the protective layer and is arranged beside the pad. The interconnection unit is not in contact with the pad. A part of the bump is arranged on the adhesive layer. The bump is electrically connected to the pad through the adhesive layer. The bump is welded to the wire. A first part of the bump overlaps the pad and a second part of the bump is extended to the outside of the pad and partially overlaps the interconnection unit.</p> |
