A semiconductor package is provided. The semiconductor package according to the embodiment of the present invention includes a first semiconductor chip arraign in the lower part and facing each active surface and a second semiconductor chip arraign in the upper part; a first molding member encapsulating the first semiconductor chip and exposing the active surface of the first semiconductor chip through the upper surface; a first rewiring formed on the active surface of the first semiconductor chip and the upper surface of the first molding member; a second rewiring formed on the lower surface of the first molding member; a through via penetrating the first molding member and electrically connecting the first rewiring and the second rewiring ; a first connection member arranged between the first semiconductor chip and the second semiconductor chip.
