| 摘要 |
PURPOSE: An adhesive composition is provided to have excellent workability and adhesion force in a dicing process, and to prevent pickup failure by applying elastic modulus to an adhesive layer. CONSTITUTION: An adhesive composition comprises an acrylic copolymer with a weight average molecular weight of 500,000-2,000,000 and a glass transition temperature of (-40)-20 deg. C, a UV-curable acrylate compound, a photoinitiator, and a thermal curing agent. A dicing tape for a semiconductor wafer includes a substrate film, an adhesive layer, and a release film. The adhesive layer is obtained by continuously UV-curing and heat cuing the adhesive composition in a line in a UV-curing device(7) and a heat-curing chamber(6). The substrate film is a polyolefin film or a polyvinyl chloride film. |
