| 摘要 |
Provided are an electroless copper plating bath and an electroless copper plating method for enabling to use in neutral pH condition without formaldehyde, increasing the stability of the plating bath, and forming a plating film with proper thickness while electrodepositing a pattern only. In the present invention, the electroless copper plating bath in pH 4-9 contains water soluble copper salt, and amino boron or substituted derivatives thereof as a reducing agent, and also contains polyamino polyphosphonic acid, anionic surfactant, antimony compound, and nitrogen-containing aromatic compound as a complex agent. [Reference numerals] (AA) Deposition film thickness [關m/hrs];(BB) End part cutting generation;(CC) Antimony concentration [mg/L] |
