| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser machining apparatus and a laser machining method capable of applying uniform laser machining without depending on a laser irradiation surface state of a workpiece.SOLUTION: A laser machining apparatus is for applying laser machining to a workpiece, and includes a laser beam irradiation means that includes a chuck table for holding the workpiece, a laser oscillator, and a machining head having a condensing lens for collecting laser beam oscillated from the laser oscillator, a reflection light quantity detection means that detects the reflection light quantity of the laser beam irradiated to the workpiece held on the chuck table from the laser beam irradiation means, and an output adjusting means that adjusts the output of the laser beam oscillated from the laser oscillator based on the reflection light quantity detected by the reflection light quantity detection means. |
