| 摘要 |
The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, comprising a copper core (2) with a surface and coating layer (3), which coating layer (3) is superimposed over the surface of the core (2), wherein the coating layer (3) comprises aluminium, wherein in any cross-sectional view of the wire the area share of the coating layer (3) is in the range of from 20 to 50 %, based on the total area of the cross-section of the wire, and wherein the aspect ratio between the longest path and the shortest path through the wire in any cross-sectional view is in the range of from larger than 0.8 to 1.0, and wherein the wire has a diameter in the range of from 100 mum to 600 mum. The invention further relates to a process for making a wire, to a wire obtainable by said process, to an electric device comprising at least two elements and at least aforementioned wire, to a propelled device comprising said electric device and to a process of connecting two elements through aforementioned wire by wedge bonding. |
