Apparatus for determining thermal power emitted from heat source used in semiconductor field, has electrical device including windings which are in thermal contact with heat region and cooling region of heat-conducting device

摘要

The apparatus (1) has a heat-conducting device (2) which absorbs the heat energy emitted by heat source. An electrical device (3) is provided with winding (20) which is in thermal contact with heat region (4) of heat-conducting device, and winding (21) which is in thermal contact with cooling region (5) of heat-conducting device. The windings are arranged in parallel, and are transverse to heat flow direction.