| 摘要 |
To provide a multilayer flexible printed wiring board with an increased volume of an insulation resin layer with a low dielectric constant surrounding a signal line by removing part of insulation resin equipped with the signal line and laminating resin with a low dielectric constant. The multilayer flexible printed wiring board comprises the signal line 8, a plane layer 12 and a plurality of layers, has an insulation layer provided around the signal line and between the signal line and the plane layer, and has a micro strip line structure or a strip line structure. Three-layered insulation layers 9, 10 and 11 are provided around the signal line. |
