| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method which efficiently cuts a lamination body, in which a resin layer is laminated on a substrate body formed by one of or both of a ceramic and a metal, at low costs, and to provide a manufacturing method of a resin sealing electronic component.SOLUTION: In a cutting method of this invention, a lamination body 10, in which a resin layer 12 is laminated on a substrate body 11 formed by at least one of a ceramic and a metal, is cut by a laser beam. The lamination body 10 further includes a laser beam absorbent material 13, and the laser beam absorbent material 13 is laminated on a surface of the resin layer 12 which is opposite to the substrate body 11. The laser beam is radiated to the laser beam absorbent material 13 thereby cutting the lamination body 10. |
