发明名称 RELEASE FILM, COMPRESSION MOLDING METHOD, AND COMPRESSION MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a release film that has excellent handling and excellent mold releasability, and is used for compression molding of a molding material; a compression molding method that can efficiently perform compression molding; and a compression molding apparatus that can efficiently mold.SOLUTION: When a molding material is performed by compression molding by a mold for a sealing material of an optical semiconductor element or a reflection frame material, or lens molding, a release film is used to be placed between the molding material and the mold, and the release film is characterized by having a silicone cured material layer to at least a surface to touch the molding material. In addition, a compression molding method uses the film, and a compression molding apparatus uses the film.
申请公布号 JP2013230618(A) 申请公布日期 2013.11.14
申请号 JP20120104071 申请日期 2012.04.27
申请人 DOW CORNING TORAY CO LTD 发明人 MORITA YOSHIJI;YOSHIDA SHIN;ENDO SHUJI
分类号 B29C43/32;B29C33/68;B29C43/18;B32B27/00 主分类号 B29C43/32
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