| 摘要 |
PROBLEM TO BE SOLVED: To provide a system and a method for revealing thermal behavior characteristics of complex 3-D submicron electronic devices.SOLUTION: A CCD camera 202 records multiple points of light energy reflected from an integrated circuit to obtain a static temperature measurement. The system is used to non-invasively measure with submicron resolution the 2-D surface temperature field of an activated device. A CW laser 308 illuminates a single point on the surface of an active device, and a photodetector records the reflected light energy to obtain a transient temperature measurement. The measured 2-D temperature field is used as input for an ultra-fast inverse computational solution to reveal the thermal behavior characteristics of the complex 3-D device. The system extracts geometric features of a known device in order to assess the system capability to combine measured and computational results to reveal characteristics of complex 3-D electronic devices. |
