| 摘要 |
PROBLEM TO BE SOLVED: To provide: a laminate structure capable of maintaining the coefficient of linear thermal expansion of the entire photosensitive resin layer as low as possible, causing no deterioration in resolution, excellent in adhesion between the photosensitive resin layer and a substrate, and causing no peeling in PCT and cold heat cycle, specifically a laminate structure of a printed wiring board or the like; and a photosensitive dry film used for a solder resist, an interlayer resin insulation layer or the like of the laminate structure.SOLUTION: In a laminate structure including at least a substrate (1) and a photosensitive resin layer or cured coating layer (2) formed on the substrate and containing an inorganic filler (3), the content ratio of the inorganic filler in the photosensitive resin layer or cured coating layer is low on a side in contact with the substrate and high on a surface side distant from the substrate, and the coefficient of linear thermal expansion of a cured product in the photosensitive resin layer or the cured coating layer is 15 to 35×10/K. |
