| 摘要 |
Circular arrays of LED dies are mounted on a substrate. The substrate has bottom electrodes electrically connected to electrodes of the LED dies. A plurality of disc-shaped remote phosphor structures are pre-formed, where each phosphor structure includes a lower transparent plate, an upper transparent plate, and a phosphor layer sandwiched between the two plates. Each phosphor structure is then affixed over an associated circular array of LED dies. A white silicone material is then compression-molded over the substrate, extending from the substrate surface to at least the sides of the upper transparent plates. The substrate is then singulated between all adjacent phosphor structures, so that the reflective material surrounds each phosphor structure and LED array, to form individual packaged lamps. The reflective material reflects side light from the LED dies and phosphor layer to cause reflected light to be emitted from a top surface of the upper transparent plate. |
