| 摘要 |
PURPOSE: An adhesive composition is provided to ensure high reliability-based maintenance in that the adhesive composition in that the solidification does not progress, and to effectively connect electronic parts in that the solidification occurs by a radical component at bonding process temperature. CONSTITUTION: An adhesive composition for connecting electronic parts consists of thermosetting resin and hardener. The hardener generates a radical which starts the solidification of the thermosetting resin. The composition further includes a radical trap component to consume the radical. The radical trap component is added to the level at which the radical bonds with the composition completely, and the bonding radical is generated below the bonding temperature of the adhesive composition. The radical trap component is added by 0.1-0.001 equivalent ratio to the hardener. |
